EXECUTIVE COMMITTEE
Conference General Chairs:
Kazuyoshi Ueno, Shibaura Institute of Technology
Stefan E. Schulz, TU-Chemnitz
Paul Besser, Entegris
Program Chairs:
Kuan-Neng Chen, National Chiao Tung University
Axel Preusse, GLOBALFOUNDRIES
Hui Jae Yoo, Intel
Program Co-Chairs:
Soo-Hyun Kim, Yeungnam University
Robert Socha, ASML
Zhihong Chen, Purdue University
Treasurer:
Tatsuya Usami, Renesas Electronics
John Zhu, Qualcomm
Workshop Chairs:
Yasuhiro Kawase, Mitsubishi Chemical
Andrew Yeoh, Applied Materials
Supplier Relations:
Hiroyuki Nagai, Tokyo Electron Ltd.
Luke Henderson, BASF Electronic Materials
Mansour Moinpour, EMD Performance Materials (Merk)
Publicity
Susumu Matsumoto, Tower Partners Semiconductor Co., Ltd
Christopher Wilson, imec
Local Arrangements
Takeshi Furusawa, HD MicroSystems
Shinichi Ogawa, AIST
ASIA
Sang Hoon Ahn, Samsung Electronics Co.
Chee Lip Gan, Nanyang Technological University
Yoshihisa Kagawa, Sony Corp.
Rak-Hwan Kim, Samsung Electronics Co.
Choon-Hwan Kim, Hynix Semiconductor
Takahiro Kouno, Socionext
Ming-Han Lee, TSMC
Yeow Kheng Lim, STATS ChipPac
Chih-Chien Liu, UMC
Masayoshi Tagami, Kioxia Corp.
Tetsu Tanaka, Tohoku University
Kazumichi Tsumura, Toshiba Corp.
EUROPE
Jean-Marc Girard, Air Liquide Electronics
Philippe Rodriguez, CEA Leti
Claire van Lare, ASML
Romy Liske, GLOBALFOUNDRIES
Zsolt Tokei, imec
NORTH AMERICA
Sanjeev Aggarwal,Everspin
Kathleen Dunn, Suny Polytechnic Institute
Dan Edelstein, IBM
Daniel Gall, Rensselaer Polytechnic Institute
Mark Kellam, Rambus
Nick Lanzillo, IBM
Kaoru Maekawa, Tokyo Electron Ltd.
Tom Mountsier, Lam Research
Mehul Naik, Applied Materials
Todd Ryan, Intel
Valeriy Sukharev, Mentor Graphics
Glen Wilk, ASM
Xiaopeng Xu, Synopsys
Mark Zaleski, Micron