iitc2021

Virtually or hybrid format in Kyoto

Committee

EXECUTIVE COMMITTEE

Conference General Chairs:

Kazuyoshi Ueno, Shibaura Institute of Technology
Stefan Schulz, TU-Chemnitz
Paul Besser, Entegris

Program Chairs:

Kuan-Neng Chen, National Chiao Tung University
Axel Preusse, GLOBALFOUNDRIES
Hui Jae Yoo, Intel

Program Co-Chairs:

Soo-Hyun Kim, Yeungnam University
Robert Socha, ASML
Zhihong Chen, Purdue University

Treasurer:

Tatsuya Usami, Renesas Electronics
John Zhu, Qualcomm

Workshop Chairs:

Yasuhiro Kawase, Mitsubishi Chemical
Andrew Yeoh, Applied Materials

Supplier Relations:

Hiroyuki Nagai, Tokyo Electron Ltd.​
Luke Henderson, BASF Electronic Materials
Mansour Moinpour, EMD Performance Materials (Merk)

Publicity

Susumu Matsumoto, Tower Partners Semiconductor Co., Ltd
Christopher Wilson, imec

Local Arrangements

Takeshi Furusawa, HD Micro Systems
Shinichi Ogawa, AIST

ASIA

Sang Hoon Ahn, Samsung Electronics Co.
Chee Lip Gan, Nanyang Technological University
​Yoshihisa Kagawa, Sony Corp.
Rak-Hwan Kim, Samsung Electronics Co.
Choon-Hwan Kim, Hynix Semiconductor

Takahiro Kouno, Socionext
Ming-Han Lee, TSMC
Yeow Kheng Lim, STATS ChipPac
Chih-Chien Liu, UMC
Masayoshi Tagami, Kioxia Corp.
Tetsu Tanaka, Tohoku University
Kazumichi Tsumura, Toshiba Corp.

EUROPE

Jean-Marc Girard, Air Liquide Electronics
Philippe Rodriguez, CEA Leti
Claire van Lare, ASML
Romy Liske, GLOBALFOUNDRIES
Zsolt Tokei, imec

NORTH AMERICA

Sanjeev Aggarwal,Everspin
Kathleen Dunn, Suny Polytechnic Institute
Dan Edelstein, IBM
Daniel Gall, Rensselaer Polytechnic Institute
Mark Kellam, Rambus
Nick Lanzillo, IBM
Kaoru Maekawa, Tokyo Electron Ltd.

Tom Mountsier, Lam Research
Mehul Naik, Applied Materials
Todd Ryan, Intel
Valeriy Sukharev, Mentor Graphics
Glen Wilk, ASM
Xiaopeng Xu, Synopsys
Mark Zaleski, Micron