Paper submission site is closed on March 21 (JST UCT+0900), 2021
The 24th edition of IITC is sponsored by the IEEE Electron Devices Society and is co-sponsored by the Japan Society of Applied Physics as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI applications.
IITC 2021 will be held in hybrid format comprising a virtual and in-person meeting (Kyoto Research Park, Kyoto, Japan), July 6-9, 2021.
The conference seeks papers on all aspects of BEOL/MOL/3D interconnects and metallization, including design, unit process, integration, and reliability. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects and heterogeneous integration.
APPLICATIONS OF INTEREST
• Advanced interconnects: low-k interconnects, optical, wireless, and carbon-based interconnects, beyond Cu…
• Contacts on MOS devices: Silicide, III-V, 2D materials…
• Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNAND…
• 3D integration & packaging concerns: 2.5D/3D interconnection, advanced interconnection for FOWLP, WtW/CtW bonding, Interposer, Through Si Via, CPI…
• Novel System and Emerging Technology: Energy harvesting, brain-inspired computing, backend devices…
• Novel Form Factors: flexible electronics, wearables…
TOPICS OF INTEREST
• Process integration, advanced patterning for MOL/BEOL
• Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, ALD, selective deposition/SAMs, patterning)
• Reliability and Failure analysis, Characterization, techniques and methods
• Advanced material/process characterization, design-technology co-optimization, and modelling techniques
ABSTRACT INFORMATION
• Regular papers, with 3-page abstracts, will be selected for either oral or poster presentation.
• A 2-page abstracts option, e.g., from students and young scientists, will undergo the same review process but will be accepted only for poster presentation.
• All submissions are rigorously reviewed.
• The conference proceedings will be submitted to the IEEE Xplore Digital Library®.
WORKSHOP, KEYNOTE, & INVITED SPEAKERS
Prior to the technical program, a workshop on “Metallization Technologies and Their Applications in IoT and AI Devices” by seven leading experts will be held on July 6. The technical program will feature exciting talks by 2 keynote speakers and 13 invited speakers.
WORKSHOP
Title | Speakers |
Innovation to Open New Paradigm for ICAC5/GX/DX | Manabu Tsujimura (Ebara) |
Reliability Challenges in Advanced Interconnects | Olalla.Varela Pedreira (imec) |
Metallization Challenges in 3D Flash Memory | Masayoshi Tagami (KIOXIA) |
STT-MRAM Technology – Applications and Scalability Challenges | Kang Ho Lee (Samsung) |
3D Stacking Technologies for Advanced CIS | Yoshihisa Kagawa (Sony Semiconductor Solutions) |
Extending Silicon Technology for High-Bandwidth Optical Communications and Neuromorphic Computing | Bert Jan Offrein (IBM) |
NanoBridge Technology for Low-power and Rad-hard AIoT Applications | Munehiro Tada (Nanobridge Semicon.) |
KEYNOTE SPEAKERS
Title | Speakers |
3D Heterogeneous Integration for Intelligent Mobile System | Prof. Mitsumasa Koyanagi Senior Research Fellow, New Industry Creation Hatchery Center, Tohoku University |
Foundry Challenges and Opportunities Near the End of Moore’s Era | Dr. Gitae Jeong Head of Corporate Office/Technology Development Samsung Electronics |
CONFIRMED INVITED SPEAKERS
Topics | Speakers |
Advanced Interconnect | Kichul Park (Samsung) |
Koichi Motoyama (IBM) | |
Integration/Pattering | Nelson Felix (IBM) |
Bob Socha (ASML) | |
DTCO | Gary Lauterbach (Cerebras) |
RC Scaling | Mauro Kobrinsky (Intel) |
MOL Contacts | Nicolas Breil (AMAT) |
Reliability | TBD |
3D | Perrine Batude (CEA-Leti) |
Memory | David Lehninger (Fraunhofer) |
Sumio Ikegawa (Everspin) | |
Novel System | Elisa Vianello (CEA-Leti) |
Beyond Cu | Junichi Koike (Tohoku Univ.) |