iitc2021

Virtually or hybrid format in Kyoto

IITC 2021 Call for Paper

Deadline for Submission extended to March 14, 2021

The 24th edition of IITC is sponsored by the IEEE Electron Devices Society and is co-sponsored by the Japan Society of Applied Physics as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI applications.


IITC 2021 will be held virtually, July 6-9, 2021. A decision will be made in April whether to hold the IITC in Kyoto in a Virtual only or hybrid format.
The conference seeks papers on all aspects of BEOL/MOL/3D interconnects and metallization, including design, unit process, integration, and reliability. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects and heterogeneous integration.

APPLICATIONS OF INTEREST

• Advanced interconnects: low-k interconnects, optical, wireless, and carbon-based interconnects, beyond Cu…
• Contacts on MOS devices: Silicide, III-V, 2D materials…
• Memory architecture: CBRAM, PCRAM, ReRAM, MRAM, DRAM, 3DNAND…
• 3D integration & packaging concerns: 2.5D/3D interconnection, advanced interconnection for FOWLP, WtW/CtW bonding, Interposer, Through Si Via, CPI…
• Novel System and Emerging Technology: Energy harvesting, brain-inspired computing, backend devices…
• Novel Form Factors: flexible electronics, wearables…

TOPICS OF INTEREST

• Process integration, advanced patterning for MOL/BEOL
• Materials and Unit Processes (Dielectrics, Metals, barriers, Wet, CMP, PVD, CVD, ALD, selective deposition/SAMs, patterning)
• Reliability and Failure analysis, Characterization, techniques and methods
• Advanced material/process characterization, design-technology co-optimization, and modelling techniques

ABSTRACT INFORMATION

• Regular papers, with 3-page abstracts, will be selected for either oral or poster presentation.
• A 2-page abstracts option, e.g., from students and young scientists, will undergo the same review process but will be accepted only for poster presentation.
• All submissions are rigorously reviewed.
• The conference proceedings will be submitted to the IEEE Xplore Digital Library®.

WORKSHOP, KEYNOTE, & INVITED SPEAKERS

Prior to the technical program, a workshop on “Metallization Technologies and Their Applications in IoT and AI Devices” by seven leading experts will be held on July 6. The technical program will feature exciting talks by 2 keynote speakers and 13 invited speakers.

WORKSHOP

Title (Tentative)Speakers
Innovation to Open New Paradigm for ICAC5/GX/DXManabu Tsujimura
(Ebara)
Reliability Challenges in Advanced InterconnectsOlalla.Varela Pedreira (imec)
Metallization Challenges in 3D NANDMasayoshi Tagami (KIOXIA)
STT-MRAM Technology – Applications and Scalability ChallengesKang Ho Lee (Samsung)
3D Stacking Technologies for Advanced CISYoshihisa Kagawa (Sony Semiconductor Solutions)
Extending Silicon Technology for High-Bandwidth Optical Communications and Neuromorphic ComputingBert Jan Offrein (IBM)
NanoBridge Technology for Low-power and Rad-hard AIoT ApplicationsMunehiro Tada
(Nanobridge Semicon.)

KEYNOTE SPEAKERS

TitleSpeakers
3D Heterogeneous Integration for Intelligent Mobile SystemProf. Mitsumasa Koyanagi
Senior Research Fellow, New Industry Creation Hatchery Center,
Tohoku University
Foundry Challenges and Opportunities Near the End of Moore’s EraDr. Gitae Jeong
Head of Corporate Office/Technology Development
Samsung Electronics

CONFIRMED INVITED SPEAKERS

TopicsSpeakers
Advanced InterconnectKichul Park (Samsung)
Koichi Motoyama (IBM)
Integration/PatteringNelson Felix (IBM)
Bob Socha (ASML)
DTCOGary Lauterbach (Cerebras)
RC ScalingMauro Kobrinsky (Intel)
MOL ContactsNicolas Breil (AMAT)
ReliabilityTBD
3DPerrine Batude (CEA-Leti)
MemoryDavid Lehninger (Fraunhofer)
Sumio Ikegawa (Everspin)
Novel SystemElisa Vianello (CEA-Leti)
Beyond CuJunichi Koike (Tohoku Univ.)