Virtually or hybrid format in Kyoto

IITC 2021


The safety and health of conference participants is a priority of IEEE. After researching and evaluating the latest status of COVID-19, the IITC committee decided to hold IITC 2021 virtually. It will be decided whether to hold IITC virtually only or hybrid format in Kyoto later through careful investigation of the status of the pandemic in April.

On behalf of the IEEE International Interconnect Technology Conference (IITC) Executive Committee, it is our pleasure to announce IEEE IITC 2021 and invite you to contribute to and attend the conference.

IITC 2021 will be held on July 6-9, 2021 virtually only or in hybrid format in Kyoto, Japan.

IITC is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

The 24th edition of International Interconnect Technology Conference (IITC) is soliciting contributions highlighting innovative research and development in the critically important field of on-chip interconnects, integration and metallization, including design, unit process, integration and reliability.

We look forwarding to your paper submission to IITC 2021.