Virtually or hybrid format in Kyoto

IITC 2021


On behalf of the IEEE International Interconnect Technology Conference (IITC) Executive Committee, it is our pleasure to invite you to attend The 24th edition of International Interconnect Technology Conference (IITC). It will be held in hybrid format comprising a virtual and in-person meeting (Kyoto Research Park, Kyoto, Japan), July 6-9-2021.

IITC is sponsored by the IEEE Electron Devices Society and co-sponsored by the Japan Society of Applied Phyics as a premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

The conference will start with one-day workshop on July 6th entitled “Metallization Technologies and Applications in IoT and AI Devices” presented by seven leading experts.

In the technical program, our keynotes will be given by two outstanding technology leaders:
Prof. Mitsumasa Koyanagi, Senior Research Fellow, New Industry Creation Hatchery Center, Tohoku University, “3D Heterogeneous Integration for Intelligent Mobile System”
Dr. Gitae Jeong, Corporate EVP, Head of Corporate Office/Technology Development, Samsung Electronics, “Foundry Challenges and Opportunities Near the End of Moore’s Era”

The technical program also includes 13 invited, 27 contributed, and 25 poster papers presenting original and state-of-the-art work.

The virtual conference will feature pre-recorded presentations with live Q&A.
On-demand video will be available from June 6 through August 20, 2021.

Throughout the conference, there will be opportune moments to network and chat with industry peers and meet the conference exhibitors and sponsors with using a virtual platform.

  • Early registration is by June 5th 2021.
  • Late registration is available until August 20th 2021.

We look forwarding to seeing you at IITC 2021.